How does trace moisture affect SMT production?

  • Trace moisture causes failures to components and PCBs during high temperature reflow process. When absorbed moisture rapidly expand from high temperatures, common internal component damages and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components.
  • Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture inside the layers causes expansion during the reflow process.